Engineering Materials and Processes
Devices, Interconnects and Packaging
By: Ehrenfried Zschech (Editor), Caroline Whelan (Editor), Thomas Mikolajick (Editor)
Hardcover | 1 September 2005
At a Glance
Hardcover
$329.00
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ISBN: 9781852339418
ISBN-10: 1852339411
Series: Engineering Materials And Processes
Published: 1st September 2005
Format: Hardcover
Language: English
Number of Pages: 532
Audience: General Adult
Publisher: Springer Nature B.V.
Country of Publication: GB
Dimensions (cm): 24.13 x 16.51 x 3.81
Weight (kg): 0.92
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