Embedded Dielectrics For Electronic Packaging

Name: Embedded Dielectrics For Electronic Packaging
Brand: WORLD SCIENTIFIC PUB CO INC
Price: 224.75 AUD
Availability: PreOrder

By: Ching-ping Wong, Rong Sun, Shuhui Yu

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Hardcover | 31 December 2026

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Hardcover
300 Pages

Hardcover

RRP $248.99

$224.75

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Available: 31st December 2026

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This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

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