Electroless Copper and Nickel-Phosphorus Plating

Author contact details Preface Acknowledgements Chapter 1: Introduction to electroless copper and nickel-phosphorus (Ni-P) depositions Abstract: 1.1 Electroless copper deposition 1.2 Electroless nickel-phosphorus (Ni-P) deposition 1.3 How to plate the depositions in the laboratory 1.4 Research objectives 1.5 Structure of the book Part I: Electroless copper depositions Chapter 2: Surface morphology evolution of electroless copper deposits Abstract: 2.1 Introduction and surface morphology of the substrate 2.2 Formaldehyde high temperature solution deposits 2.3 Glyoxylic acid high temperature solution deposits 2.4 Formaldehyde high concentration low temperature (FHCLT) solution deposit 2.5 Formaldehyde low concentration low temperature (FLCLT) solution deposit 2.6 Glyoxylic acid high concentration low temperature (GHCLT) solution deposit 2.7 Glyoxylic acid low concentration low temperature (GLCLT) solution deposit 2.8 Electroplated and electroless copper deposits 2.9 Conclusions Chapter 3: Cross-section of electroless copper deposits and the void fraction Abstract: 3.1 Calculating the void fraction on an electron microscopy cross-section image 3.2 Determination of the optimum threshold values of grey scale and noise 3.3 The voids 3.4 Conclusions Chapter 4: Crystal structure and surface residual stress of electroless copper deposits Abstract: 4.1 X-ray normal scan patterns and the crystal structures of the deposits 4.2 Tilted scan patterns and the surface residual stress of the electroless copper 4.3 The error in calculating the position and the relative intensities of the peaks 4.4 The error in linear regression for surface residual stress analysis 4.5 Conclusions Chapter 5: The atomic model of the diamond pyramid structure in electroless copper deposits Abstract: 5.1 The unit diamond pyramid structure in a face centred cubic crystal lattice 5.2 Multi-layer atomic model 5.3 Twinning in the diamond pyramid model 5.4 The role of surface stress in the formation of twinning in a diamond pyramid 5.5 Conclusions Chapter 6: Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits Abstract: 6.1 Simulation setup 6.2 Preparing models for molecular dynamics calculation 6.3 The effect of surface stress on the shape of the diamond pyramid structure 6.4 The relaxation of the diamond pyramid structure with different sizes 6.5 The effect of temperature on the relaxation of the diamond pyramid structure 6.6 The effect of temperature on the formation of voids in the electroless deposit 6.7 The formation and growth of the diamond pyramid structure in deposit 6.8 The radial distribution function (RDF) and the Fourier transform of X-ray diffraction (XRD) 6.9 Conclusions Chapter 7: Adhesion strength of electroless copper deposit to epoxy board Abstract: 7.1 Adhesion testing 7.2 Image processing for calculating pull-off fraction parameter of adhesion 7.3 Fracture surface 7.4 Image processing and the pull-off fraction parameter of adhesion testing 7.5 Adhesion strength of electroless copper deposits 7.6 Two failure modes for a partly pulled-off specimen 7.7 Conclusions Chapter 8: Electrical resistivity of electroless copper deposit Abstract: 8.1 Four-point probe method for the electrical resistance analysis 8.2 Calculation of the thickness of the deposits using the weight gain method 8.3 The error of calculating the digital length of a curve 8.4 The surface cross-section curve and the correction factors of FR4 8.5 The plating rates of the electroless copper deposits in different solutions 8.6 The sheet resistance and resistivity of the electroless copper deposit 8.7 Conclusions Chapter 9: Applications of electroless copper deposits Abstract: 9.1 Printed circuit board (PCB) industry 9.2 Properties of electroless copper deposition and their evaluation 9.3 Diffusion based simulation Part II: Electroless nickel-phosphorus (Ni-P) depositions Chapter 10: Crystallisation of nickel-phosphorus (Ni-P) deposits with high phosphorus content Abstract: 10.1 Introduction 10.2 Effects of phosphorus content 10.3 Effects of the heating process and degree of phase transformation 10.4 X-ray diffraction (XRD) data analysis procedures 10.5 Grain size and microstrain in the platings 10.6 Scanning electron microscopy (SEM) and electron microprobe analysis 10.7 Microstructural evolution of nickel-phosphorus (Ni-P) deposits with heat treatment 10.8 Conclusions Chapter 11: Crystallisation of nickel-phosphorus (Ni-P) deposits with medium and low phosphorus content Abstract: 11.1 Calorimetric study and the major exothermal peak 11.2 X-ray diffraction (XRD) analysis 11.3 Degree of phase transformation 11.4 The major exothermal peak 11.5 Conclusions Chapter 12: Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus (Ni-P) deposits Abstract: 12.1 Introduction 12.2 Thermodynamic analysis of crystallisation in amorphous solids 12.3 Application of Johnson-Mehl-Avrami (JMA) theory in isothermal crystallisation 12.4 Electroless and melt quenched nickel-phosphorus (Ni-P) 12.5 Melt quenched Fe40Ni40P14B6 12.6 Johnson-Mehl-Avrami kinetic modelling of non-isothermal crystallisation 12.7 Determination of degree of transformation 12.8 Modelling of crystallisation kinetics 12.9 Comparison between simulations and experimental data 12.10 Conclusions Chapter 13: Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits Abstract: 13.1 Artificial neural network (ANN) modelling 13.2 Performance of neural networks 13.3 Comparison between calculations and experimental data 13.4 MatLab programming for simulation of peak temperatures versus heating rate 13.5 Prediction using the model 13.6 Application of the model 13.7 Conclusions Chapter 14: Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing Abstract: 14.1 Concept of kinetic strength 14.2 Thermal processing and phase structure 14.3 Vickers surface hardness 14.4 Vickers hardness of the cross-sections 14.5 Knoop hardness over the depth of cross-sections 14.6 Kinetics of increased hardening effects 14.7 Microstructure and hardness of alloy coatings containing tin and tungsten 14.8 Conclusions Chapter 15: Applications of electroless nickel-phosphorus (Ni-P) plating Abstract: 15.1 Comparisons with other common engineering deposits 15.2 Advantages of electroless nickel-phosphorus (Ni-P) deposits 15.3 Enhancement through heat-treatment processes 15.4 Electroless nickel-phosphorus-silicon carbide (Ni-P-SiC) coated aluminium cylinder liner: a research case study 15.5 Development and future trends 15.6 Conclusions Index