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Electrical Engineering

By: Darrel R. Frear, John H. Lau, D. R. Frear

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Hardcover | 31 January 1994

At a Glance

Hardcover
436 Pages

Dimensions(cm)
23.5 x 15.88 x 3.18

Hardcover

$329.00

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As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electronic packages. With the critical nature of these small electrical-mechanical interconnections, the question arises: Just how reliable are the solder joints in a modern electronic package? The authors will answer this question by addressing the materials and mechanics issues associated with solder joints in this state-of-the-art assessment.
The reader will learn the basic metallurgy of solder alloys, the constitutive models available for modeling solder interconnects, computational simulations to predict solder joint geometry, and the application of mechanics models to through-hole and surface mount technologies.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a "stand-alone" resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

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You Can Find This Book In

Non-Fiction Engineering & Technology Mechanical Engineering & Materials Materials Science Industrial Chemistry & Manufacturing Technologies Science Physics Computing & I.T.Computer Programming & Software Development Algorithms & Data Structures Production & Industrial Engineering

Foreword
Acknowldgement
Introduction: the mechanics of soldere alloy interconnect
Microstructural influences on the mechanical properties of solder
Interfaces and intermetallics
Constitutivemodels
Prediction of solder joint geometry
Life prediction and accelerated testing
Thermomechanical modeling of solder joints - numerical considerations
Applications - through-hole
Surface mount solder joints under thermal, mechanical, and vibration conditions
Index
Table of Contents provided by Publisher. All Rights Reserved.

Electrical Engineering

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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