E; Ectrical Engineering

Technology for Multichip Modules

By: John H. Law, John H. Lau

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Hardcover | 30 June 1994

At a Glance

Hardcover
580 Pages

Dimensions(cm)
23.5 x 15.88 x 3.18

Hardcover

$329.00

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This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

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Preface
Acknowledgments
A Brief Introduction to Wire Bonding, Tape Automated Bonding, and Flip Chip on Board for Multichip Module Applications	p. 1
Making COB Testing Tractable: Chip Pretest and System Diagnostics	p. 101
Chip Level Interconnect: Wire Bonding for Multichip Modules	p. 124
Chip Level Interconnect: Wafer Bumping and Inner Lead Bonding	p. 186
Chip Level Interconnect: Solder Bumped Flip Chip	p. 228
Chip Attachment	p. 251
Wire Bonding Chip on Board	p. 275
Tape Automated Bonding Chip on Board and on MCM-D	p. 343
Solder Bumped Flip Chip Attach on SLC Board and Multichip Module	p. 410
Micron Bump Bonding Chip on Board	p. 444
Chip on Board Encapsulation	p. 470
Underfill Encapsulation for Flip Chip Applications	p. 504
Authors' Biographies	p. 533
Index	p. 545
Table of Contents provided by Blackwell. All Rights Reserved.

E; Ectrical Engineering

Technology for Multichip Modules

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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