There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Session 1: Overview, Steel Bonding and Quality Control.- Diffusion Bonding-An Overview.- Ambient-Temperature Creep Failure of Silver-Interlayer Diffusion Bonds between Steel.- Diffusion Bonding by Hot Extrusion of Incoloy 825 and Duplex 2205 to a Low Alloy Steel.- Study of the Microstructure Obtained after Diffusion Bonding Inconel 625 to Low Alloy Steel by Hot Uniaxial Pressing or Hipping.- HIP Diffusion Bonding of Austenitic to Ferritic Steels.- The Control of Diffusion Bonding Quality.- Session 2: Diffusion Bonding of Aluminium Alloys.- Development of Diffusion Bonding Techniques for Al-Li Base Alloy AA8090.- Diffusion Bonding of Superplastic Aluminium Alloys Using a Transient Liquid Phase Interlayer (Zinc).- Influence of Surface Preparation on the Diffusion Welding of High Strength Aluminium Alloys.- Diffusion Bonding of Thin Aluminium Foils.- Laser Surface Modification of 8090 Alloy with Silicon for Diffusion Bonding.- Diffusion Bonding of Al-Li 8090 Alloy.- Session 3: Bonding of High Temperature Materials.- Diffusion Bonding of Ti-6Al-4V Alloy: Metallurgical Aspects and Mechanical Properties.- Resistance Diffusion Bonding of a Titanium Aluminide.- 30 Seconds Solid State Bonding of Metals.- The Diffusion Bonding of Engineering Ceramics to Nickel Based Superalloys by Hot Isostatic Pressing (HIPping).- Diffusion Bonding of Inconel 600 to Alumina.- Interfaces in Metal/Ceramic Diffusion Bonds.- Session 4: General Applications.- The Development of DB/SPF Titanium Technology for Military Aircraft Applications.- The Application of SPF/DB to Dissimilar Metal Joints.- HIP-Diffusion Bonding of ODS-Materials by Use of Plasma Sprayed Encapsulation.- Component Assembly Using HIP Diffusion Bonding.- Diffusion Bonded Windows for Diagnostics of Fusion Plasmas.- Low Temperature Diffusion Bonding of High Carat Gold Using in Situ Gold-Cadmium Alloys.- A New Aspect of Eutectic Bonding for Gold Soldering.
Number Of Pages: 316
Publisher: SPRINGER VERLAG GMBH
Country of Publication: GB
Dimensions (cm): 24.41 x 16.99
Weight (kg): 0.73
Edition Number: 2