
Automatic Layout Modification
Including design reuse of the Alpha CPU in 0.13 micron SOI technology
By:Â Michael Reinhardt
Hardcover | 30 June 2002
At a Glance
244 Pages
23.5 x 15.88 x 1.91
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| Foreword | p. xiii |
| Acknowledgments | p. xv |
| Introduction to IC Physical Design Reuse | p. 1 |
| Purpose of This Book | p. 3 |
| Structure of This Book | p. 3 |
| History of Physical Design Reuse | p. 4 |
| Physical Design Reuse in the SOC Era: Luxury or Necessity? | p. 7 |
| Increasing Design Complexity | p. 8 |
| The Design Automation Gap and Physical Challenges of UDSM Technology | p. 9 |
| Demand for Shorter Design Time | p. 11 |
| Early Access to the Latest Process Technology | p. 12 |
| Shortage of Qualified Engineering Resources | p. 13 |
| Design Cost: A Critical Factor in SOC Design | p. 14 |
| Boosting Design Capabilities with Automatic Layout Modification Technology | p. 15 |
| Speeding Up Initial Layout Creation | p. 15 |
| Compacting layouts | p. 18 |
| Automatic design-rule correction | p. 18 |
| Device size adjustment | p. 20 |
| Layout Migration Methods | p. 22 |
| Re-layout of an entire circuit | p. 22 |
| Linear shrink method | p. 23 |
| Flexible layout conversion using Automatic Layout Modification Technology | p. 25 |
| Customizing Layout Designs | p. 26 |
| High-voltage or low-voltage? | p. 26 |
| Adjusting circuit speed | p. 28 |
| Low-power applications | p. 28 |
| Adjustments for different process options | p. 30 |
| Customizing cell libraries | p. 30 |
| Achieving Timing Closure | p. 30 |
| The timing challenge in DSM technologies | p. 31 |
| Detecting timing problems inside a circuit | p. 34 |
| Changing transistor sizes | p. 38 |
| Modifying wire capacitance and resistance | p. 39 |
| Clock optimization | p. 40 |
| Solving Signal Integrity Problems in DSM Circuits | p. 40 |
| Reducing noise | p. 40 |
| Reducing crosstalk | p. 42 |
| Design Optimization | p. 43 |
| Timing optimization | p. 43 |
| Power optimization | p. 43 |
| Yield optimization | p. 44 |
| Electro-migration | p. 45 |
| Optical Mask Enhancement | p. 46 |
| Optical proximity correction | p. 46 |
| OPC avoidance | p. 48 |
| Phase shift mask correction | p. 49 |
| Characteristics and Functionalities of an Automatic Layout Modification Tool Suite | p. 51 |
| Migrating the Electrical Characteristics of a Layout | p. 51 |
| Signal-Specific Layout Manipulation Support | p. 55 |
| Solving signal integrity problems | p. 55 |
| Signal-specific wire sizing and spacing of critical signals | p. 56 |
| Shielding and moving signals to separate metal levels | p. 57 |
| Ensuring Layout Quality Throughout an Automatic Layout Modification | p. 59 |
| Controlling the number of notches and jogs | p. 59 |
| Handling orthogonal and non-orthogonal structures | p. 60 |
| Improving connectivity | p. 62 |
| Improving latch-up characteristics | p. 63 |
| Improving the power grid | p. 64 |
| Applying "recommended rules" | p. 66 |
| Modifying Libraries Automatically | p. 68 |
| Processing an entire library | p. 69 |
| Supporting multiple grids | p. 69 |
| Controlling power bus width and cell height | p. 70 |
| Creating pick-up ports | p. 71 |
| Checking and evaluating an entire library | p. 71 |
| Modifying Large Databases | p. 72 |
| Using distributed processing | p. 72 |
| Modifying hierarchical layouts | p. 73 |
| Using a hierarchy analysis and extraction tool | p. 74 |
| Defining and Entering Design Rules | p. 74 |
| Preparing and Analyzing Layouts | p. 74 |
| Extracting Netlists | p. 75 |
| Integrating Automatic Layout Modification Technology and Physical Design Reuse into Existing Design Flows | p. 77 |
| The Typical ASIC Design Flow | p. 78 |
| Adding Physical Design Reuse Capability to the ASIC Flow | p. 81 |
| The Layout Conversion Flow | p. 82 |
| The geometrical process relationship | p. 83 |
| The electrical process relationship | p. 84 |
| Applying Automatic Layout Modification Technology and Design Reuse Techniques to New Designs | p. 86 |
| An Incremental Approach to Timing and Signal Integrity Design Improvements | p. 87 |
| Optimizing Power Consumption and Yield Using Automatic Layout Modification Techniques | p. 88 |
| Applying Physical Design Reuse to Different Design Types with Automatic Layout Modification Technology | p. 91 |
| Digital Macro Blocks | p. 91 |
| Standard cell blocks | p. 92 |
| Digital full-custom designs | p. 94 |
| Timing closure and Physical Design Reuse | p. 95 |
| Early process access and decreased ramp-up time | p. 95 |
| Need for design portability | p. 96 |
| Integrating external IP into SOC designs | p. 97 |
| Moving to place & route-based design flows | p. 97 |
| Structured full-custom designs | p. 98 |
| Datapath designs | p. 98 |
| Memory | p. 99 |
| Analog Circuits | p. 99 |
| Standard Cell Libraries | p. 100 |
| Physical Compilers | p. 102 |
| Layout Guidelines for Physical Design Reuse and Automatic Layout Modification | p. 103 |
| General Layout Design Guidelines | p. 103 |
| Laying out polygon structures | p. 103 |
| Positioning text | p. 104 |
| Using diamond- and octagonal-shaped structures | p. 104 |
| Using 45-degree transistors | p. 105 |
| Maintaining one-to-one device and cell relationships | p. 106 |
| Separating analog structures | p. 107 |
| Modifying Hierarchical Layouts | p. 108 |
| Fulfilling the abutting cells requirement | p. 108 |
| Enforcing array-type base structures | p. 110 |
| Maintaining rotated and mirrored cells | p. 110 |
| Handling deadlock situations | p. 111 |
| Handling naming and text conventions | p. 111 |
| Matching of netlist and layout hierarchies | p. 112 |
| Partitioning Layouts (Floorplanning) for Physical Design Reuse | p. 112 |
| Reusing standard cell blocks | p. 113 |
| Reusing full-custom design blocks | p. 114 |
| Reusing mixed-signal designs | p. 114 |
| Designing Layouts for Portability | p. 114 |
| Using orthogonal versus non-orthogonal structures | p. 114 |
| Using local interconnect | p. 115 |
| Handling butted tap contacts and shared contacts | p. 116 |
| Using buried contacts | p. 117 |
| Laying Out Analog Structures | p. 117 |
| Guide to Physical Design Reuse Tools: Uses and Functions | p. 119 |
| Design Analysis Tools | p. 119 |
| Electrical (parasitic) extraction tools | p. 120 |
| Extraction methods | p. 120 |
| Determining critical signals | p. 122 |
| Critical signal extraction tools | p. 123 |
| Static and dynamic timing analysis tools | p. 123 |
| Critical signal RC delay comparison tools | p. 124 |
| Noise, crosstalk, and signal integrity analysis tools | p. 125 |
| Static and dynamic power analysis tools | p. 125 |
| Design Optimization | p. 126 |
| Timing optimization tools | p. 126 |
| Power optimization tools | p. 127 |
| Layout Modification | p. 128 |
| Place & route tools | p. 128 |
| Layout editing tools | p. 129 |
| Compaction tools | p. 130 |
| Automatic layout modification tools | p. 134 |
| Design Verification | p. 131 |
| LVS and DRC tools | p. 131 |
| Timing verification tools | p. 132 |
| General Layout Modification Design Flow as Applied to the Alpha CPU Migration | p. 133 |
| General Layout Modification Design Flow | p. 133 |
| Alpha Microprocessor Project Overview | p. 134 |
| Migration methodology | p. 135 |
| EV7 Microprocessor Core Database Assessment | p. 136 |
| The Challenge: Layout Correction | p. 136 |
| Basic design-rule violations | p. 137 |
| Poly endcap | p. 137 |
| Poly spacing | p. 137 |
| Gate spacing | p. 138 |
| Local interconnect spacing | p. 138 |
| Contact spacing | p. 138 |
| Contact/local interconnect overhang | p. 139 |
| Generating a high-threshold voltage mask | p. 140 |
| Impact of hierarchy on layout correction | p. 141 |
| No metal modification allowed | p. 142 |
| Maintaining the same number of leaf cells | p. 142 |
| Exclusion of certain cells and "don't-touch" areas | p. 142 |
| The Alpha Layout Modification Flow | p. 142 |
| Phase 1: Hierarchical Linear Shrink and Lambda Approach | p. 143 |
| Phase 2: Cleaning up the Database | p. 144 |
| Removing redundant polygons | p. 144 |
| Optimizing the hierarchy | p. 145 |
| Removing unconnected diffusion and local interconnect | p. 146 |
| Phase 3: Analyzing the Database | p. 146 |
| Extracting hierarchy information | p. 146 |
| Merging macro blocks | p. 147 |
| Phase 4: Layout Correction Flow | p. 147 |
| Preparing the layout for correction | p. 148 |
| Device extraction | p. 148 |
| Netlist extraction | p. 148 |
| Extracting specific layout situations | p. 149 |
| Merging polygons | p. 150 |
| Combining polygons from different cell levels | p. 150 |
| Enlarging endcaps | p. 151 |
| Enlarging end-of-line rules for LI over-contacts | p. 152 |
| Combining cross-shaped LI on same node | p. 152 |
| Creating pseudo-contacts for LI/poly and LI/diffusion | p. 152 |
| Measuring design sizes | p. 153 |
| Checking and correction | p. 153 |
| Checking the design | p. 153 |
| Correcting the design | p. 154 |
| Phase 5: Reconstructing the Layout | p. 155 |
| External verification | p. 155 |
| Project Results | p. 155 |
| Memory and CPU time requirements | p. 155 |
| Amount of error reduction | p. 157 |
| Aspects of Memory Conversion Projects | p. 159 |
| Typical Memory Structure | p. 160 |
| Special Requirements of Memory Conversion | p. 161 |
| Handling memory bit cell | p. 161 |
| Pitch matching leaf cells | p. 162 |
| Different sizing of different memory areas | p. 164 |
| Considering all possible memory configurations | p. 164 |
| Maintaining layout hierarchy for verification | p. 164 |
| Special device sizing for drivers and sense amplifiers | p. 165 |
| Supporting a special grid for memory ports | p. 165 |
| Typical memory conversion flow | p. 166 |
| Creating typical configurations | p. 166 |
| Reducing overall complexity | p. 167 |
| Analyzing memory configurations | p. 168 |
| Calculating device sizes | p. 168 |
| Reduction or shrink factor analysis | p. 168 |
| Conversion and correction flow | p. 169 |
| Reconstructing the memory | p. 170 |
| Creating phantoms for place & route | p. 170 |
| Aspects of Library Conversion Projects | p. 171 |
| Typical Standard Cell Structures | p. 171 |
| Special Standard Cell Library Conversion Requirements | p. 174 |
| Considering all possible configurations | p. 175 |
| Special device sizing of output drivers | p. 176 |
| Supporting a special grid for ports | p. 177 |
| Standard Cell Library Conversion Flow | p. 177 |
| Enhancing the library | p. 177 |
| Calculating device sizing and power bus width | p. 177 |
| Adjusting the physical layout | p. 178 |
| Verifying the physical layout | p. 179 |
| Characterizing library cells | p. 179 |
| Updating views for EDA tools | p. 180 |
| Converting I/O Cells | p. 180 |
| I/O cell structures | p. 180 |
| Converting ESD and bonding pad structures | p. 181 |
| Converting the logic parts of I/O cells | p. 182 |
| Special-Purpose Libraries | p. 182 |
| Gate Array Libraries | p. 182 |
| Key Algorithms Used for Automatic Layout Modification Technology | p. 183 |
| Mask Operations | p. 184 |
| Logical mask operations | p. 185 |
| Selection operations | p. 186 |
| Sizing operations | p. 187 |
| Layer operations | p. 188 |
| Check functions | p. 190 |
| Implementation options for mask operations | p. 190 |
| Types of Compaction Algorithms | p. 191 |
| Symbolic compaction--polygon compaction | p. 191 |
| One-dimensional--two-dimensional | p. 192 |
| Orthogonal--non-orthogonal structures | p. 194 |
| Flat compaction--hierarchical compaction | p. 194 |
| Compaction Algorithms in ALM | p. 195 |
| Shear line or virtual grid compaction | p. 195 |
| Constraint graph compaction | p. 197 |
| Iterative edge compaction | p. 198 |
| Compaction Algorithms for Full Hierarchical Designs | p. 201 |
| Limitations of Compaction | p. 204 |
| Layout Correction Algorithms | p. 205 |
| Mask operations for design-rule correction | p. 206 |
| Grid snapping error correction after a linear shrink | p. 207 |
| Correcting hierarchical layouts | p. 207 |
| Bibliography | p. 211 |
| Glossary | p. 215 |
| Index | p. 219 |
| Table of Contents provided by Syndetics. All Rights Reserved. |
ISBN: 9781402070914
ISBN-10: 1402070918
Published: 30th June 2002
Format: Hardcover
Language: English
Number of Pages: 244
Audience: Professional and Scholarly
Publisher: Springer Nature B.V.
Country of Publication: US
Dimensions (cm): 23.5 x 15.88 x 1.91
Weight (kg): 0.52
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