Advances in CMP Polishing Technologies

By: Toshiro Doi (Editor), Ioan D. Marinescu (Editor), Syuhei Kurokawa (Editor)

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Hardcover | 6 December 2011 | Edition Number 1

At a Glance

Hardcover
330 Pages

Dimensions(cm)
22.86 x 15.24 x 1.91

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering
Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments
The authors bring together the latest innovations and research from the USA and Japan

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Contributors	p. vii
Preface	p. ix
About the Authors	p. xi
Introduction	p. 1
References	p. 2
Details of the Fabrication Process for Devices with a Silicon Crystal Substrate	p. 3
History of Semiconductor Devices and their Types	p. 3
Semiconductor Device Process Technology and Current Situation	p. 7
References	p. 13
The Current Situation in Ultra-Precision Technology û Silicon Single Crystals as an Example	p. 15
Production of Single Crystal Silicon	p. 17
Slicing: Pre- and Post-Process	p. 19
Lapping of Silicon	p. 35
Etching	p. 86
Ultra-Precision Polishing/CMP of Silicon Wafers	p. 90
Precision Cleaning (Wet Cleaning)	p. 96
Inspection of Crystal Substrate	p. 100
References	p. 110
Applications of Ultra-Precision CMP in Device Processing	p. 113
Overview of the Significance of, and Trends in, Planarization CMP	p. 113
Basic Structure of the CMP System	p. 119
Element Technology	p. 130
Role of Slurry in CMP	p. 144
Role of Pads in CMP	p. 156
Advanced Evaluation of Pad Surface Texture	p. 172
Cleaning after CMP	p. 179
Surface Defects and Inspection Tools in CMP	p. 189
Planarization Simulation Technique (Prediction/Management/Evaluation Technique)	p. 209
References	p. 226
Promising Future Processing Technology	p. 229
Electrolytic CMP (E-CMP) and Applied Techniques	p. 229
ELID Grinding of Sapphire - Experimental Approach	p. 242
ELID Grinding of Sapphire with Acoustic Emission Monitoring	p. 252
Novel Bell-Jar Shaped, Sealed, Atmosphere Controlled CMP Machine, and Precision Processing of Various Functional Materials	p. 262
Dry Etching and Planarization CMP Applications for Surface Micro-Machining	p. 273
References	p. 293
Progress of the Semiconductor and Silicon Industries - Growing Semiconductor Markets and Production Areas	p. 297
A Paradigm Shift in the" Semiconductor Industry	p. 297
Correlation Between the Electronics and Single Crystal Silicon Wafer Industry	p. 300
Analysis of Single Crystal Silicon Wafer Market for the Semiconductor Industry	p. 301
References	p. 304
Summary - The Future of CMP/Polishing Technologies	p. 305
Index	p. 309
Table of Contents provided by Ingram. All Rights Reserved.

Advances in CMP Polishing Technologies

At a Glance

Hardcover

Shipping

How to return your order

Defective items

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