Advanced Wirebond Interconnection Technology - Shankara K. Prasad

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Advanced Wirebond Interconnection Technology

By: Shankara K. Prasad

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Hardcover | 30 April 2004

At a Glance

Hardcover
704 Pages

Dimensions(cm)
23.5 x 15.88 x 3.18

Hardcover

$489.01

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From the reviews:

"This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.

The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.

The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.

This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests.

Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.

If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)

Industry Reviews

From the reviews: "...intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers... This book has excellent overall tutorial and enough description of wire and bonding equipment... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter) "This book is intended for an assembly ... . is very good with 'visual' explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)

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You Can Find This Book In

Non-Fiction Engineering & Technology Technology in General Technical Design Electronics & Communications Engineering Electronics Engineering Circuits & Components Industrial Chemistry & Manufacturing Technologies Engineering in General Computing & I.T.Computer Networking & Communications Electronic Devices & Materials

Semi-Conductors & Super-Conductors Mechanical Engineering & Materials Production & Industrial Engineering

Preface
Acknowledgments
Introduction	p. 1
Materials for wirebonding	p. 17
Bonding equipment	p. 95
Process technology	p. 163
Quality	p. 481
Reliability	p. 559
New technologies and new applications for wire bonding	p. 629
References	p. 655
Index	p. 661
About the author	p. 669
Table of Contents provided by Blackwell. All Rights Reserved.

Advanced Wirebond Interconnection Technology

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

You Can Find This Book In

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