Advanced Ta-Based Diffusion Barriers for Cu Interconnects

By: Rene Hubner

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Paperback | 1 May 2008

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102 Pages

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22.7 x 15.3 x 0.8

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Preface; Introduction; Experimental Details; Microstructure and Functional Properties of as-Deposited Ta-Based Diffusion Barriers; Thermal Stability of Ta-Based Diffusion Barriers in SiO2; Trace-Analytical Techniques for a Sensitive Proof of Cu Diffusion; Thermal Stability of Ta-Based Diffusion Barriers on Silicon and Barrier Failure Mechanisms; Conclusion; Index.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Circuits & Components Science Physics Electronic Devices & Materials Technology in General

Preface
Introduction
Experimental Details
Microstructure and Functional Properties of as-Deposited Ta-Based Diffusion Barriers
Thermal Stability of Ta-Based Diffusion Barriers in SiO2
Trace-Analytical Techniques for a Sensitive Proof of Cu Diffusion
Thermal Stability of Ta-Based Diffusion Barriers on Silicon and Barrier Failure Mechanisms
Conclusion
Index
Table of Contents provided by Publisher. All Rights Reserved.

Advanced Ta-Based Diffusion Barriers for Cu Interconnects

At a Glance

Paperback

Shipping

How to return your order

Defective items

You Can Find This Book In

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