Preface.
Acknowledgements.
Chapter 1: Fundamentals of Communication Systems.
Introduction.
1.1 Communication systems.
1.2 History and Overview of Wireless Communication Systems.
1.3 History and Overview of Wired Communication Systems.
1.4 Communication System Fundamentals.
1.5 Electromagnetics.
1.6 Analysis of circuits and systems.
1.7 Broadband,wideband and narrowband systems.
1.8 Semiconductor technology and devices.
1.9 Key circuit topologies.
1.10 Gain/Linearity/Noise.
Conclusion.
Chapter 2: Wireless Communication Systems Architectures.
Introduction.
2.1 Fundamental considerations.
2.2 Link Budget Analysis.
2.3 Propagation Effects.
2.4 Interface Planning.
2.5 Superheterodyne architecture.
2.6 Low IF architecture.
2.7 Direct conversion architecture.
2.8 Two stage direct conversion.
2.9 Current mode architecture.
2.10 Subsampling architecture.
2.11 Multi-band direct conversion radio.
2.12 Polar modulator.
2.13 Harmonic reject architectures.
2.14 Practical considerations for transceiver integration.
Conclusion.
Chapter 3: Systems Architectures for High Speed Wired Communications.
3.1 Introduction.
3.2 Band-limited channel.
3.3 Equalizer system study.
References.
Chapter 4: Mixed Signal Communication Systems Building Blocks.
Introduction.
4.1 Inverters.
4.2 Static D flipflop.
4.3 Bias circuits.
4.4 Transconductor cores.
4.5 Load networks.
4.6 A versatile analog signal processing core.
4.7 Low noise amplifier.
4.8 Power amplifiers.
4.9 Balun.
4.10 Signal Generation Path.
4.11 Mixers.
4.12 Baseband filters.
4.13 Signal strength indicator (SSI).
4.14 ADC/DAC.
Conclusion.
Chapter 5 Examples of Integrated Communication Microsystems.
Introduction.
5.1 Direct conversion receiver front-end.
5.2 Debugging: A practical scenario.
5.3 High speed wired communication example.
Conclusion.
References.
Chapter 6: Low voltage, low power and low area designs.
Introduction.
6.1. Power consumption considerations.
6.2 Device technology and scaling.
6.3 Low voltage design techniques.
6.4 Injection locked techniques.
6.5. Subharmonic architectures.
6.6. Superregenerative architectures.
6.7. Hearing aid applications.
6.8. Radio frequency identification tags.
6.9. Ultra low power radios.
Conclusion.
References.
Chapter 7: Packaging for Integrated Communication Microsystems.
Introduction.
7.1. Background.
7.2 Elements of a package.
7.4 Driving Forces for RF Packaging Technology.
7.5 MCM Definitions and Classifications.
7.6 RF - SOP modules.
7.7 Package modeling and optimization.
7.8 Future packaging trends.
7.9 Chip Package Co-design.
7.10 Package models and transmission lines.
7.11 Calculations for package elements.
7.12 Cross-talk.
7.13 Grounding.
7.14 Practical issues in working with packages.
7.15 Chip-package codesign examples.
7.16 Wafer scale package.
7.17 Filters using bondwire.
7.18 Packaging Limitation.
Conclusion.
References.
Chapter 8: Advanced SOP Components and Signal Processing.
Introduction.
8.1 History of compact design.
8.2 Previous Techniques in Performance Enhancement.
8.3 Design Complexities.
8.4 Modeling Complexities.
8.5 Compact Stacked Patch Antennas Using LTCC Multilayer Technology.
8.6 Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology.
8.7 Radiation-Pattern Improvement Using a Compact Soft Surface Structure .
8.8 A Package-Level Integrated Antenna Based on LTCC Technology.
Chapter 9: Characterization and Computer aided analysis of integrated microsystems.
Introduction.
9.1 Computer aided analysis of wireless systems.
9.2 Measurement equipments and their operation.
9.3 Network analyzer calibration.
9.4 Wafer probing measurement.
9.5 Characterization of integrated radios.
9.6 In the laboratory.
