Get Free Shipping on orders over $79
Advanced Flip Chip Packaging - C.P. Wong

Advanced Flip Chip Packaging

By: C.P. Wong (Editor), Yi-Shao Lai (Editor), Ho-Ming Tong (Editor)

Hardcover | 21 March 2013 | Edition Number 2012

At a Glance

Hardcover


$329.00

or 4 interest-free payments of $82.25 with

 or 

Ships in 5 to 7 business days

Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics. The flip chip packaging of today is drastically different from the technology of the 1990's. The demand for flip chip technology will continue to grow to meet the need for products that offer better performance, are smaller and are environmentally sustainable. "Advanced Flip Chip Packaging" presents past, present and future advances and trends in areas like substrate technology, material development and assembly processes.

More in Electronics Engineering

LEGO Gadgets : Gadgets (Klutz) - Editors of Klutz

RRP $34.99

$25.75

26%
OFF
The Art of Electronics : 3rd edition improved - Paul Horowitz

RRP $171.95

$121.75

29%
OFF
Elements of Power Electronics - Giani Smith
Recent Developments in Mechatronics - Noel Cole
Fundamentals of Robotics - Julian Evans

$461.75

Advances in Sliding Mode Control - Jim Evans
Handbook of Semiconductor Technology - Bill Fraley
Digital Electronics : A Modern Approach - Rachell Hawkins