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3D Microelectronic Packaging : From Architectures to Applications - Yan Li

3D Microelectronic Packaging

From Architectures to Applications

By: Yan Li, Deepak Goyal

eText | 23 November 2020 | Edition Number 2

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

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Non-FictionEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringCircuits & ComponentsBiochemical EngineeringBiotechnologyTechnology in GeneralNanotechnologyElectronic Devices & MaterialsIndustrial Chemistry & Manufacturing TechnologiesIndustrial Chemistry
Chemical EngineeringOther Manufacturing TechnologiesPrecision Instruments ManufactureMetals Technology & MetallurgyMechanical Engineering & MaterialsMaterials Science

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