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3D IC Stacking Technology - Banqiu Wu

3D IC Stacking Technology

By: Banqiu Wu, Sesh Ramaswami, Ajay Kumar

eBook | 14 October 2011

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The latest advances in three-dimensional integrated circuit stacking technology



With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.



3D IC Stacking Technology covers:



  • High density through silicon stacking (TSS) technology


  • Practical design ecosystem for heterogeneous 3D IC products


  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack


  • Process integration for TSV manufacturing


  • High-aspect-ratio silicon etch for TSV


  • Dielectric deposition for TSV


  • Barrier and seed deposition


  • Copper electrodeposition for TSV


  • Chemical mechanical polishing for TSV applications


  • Temporary and permanent bonding


  • Assembly and test aspects of TSV technology


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You Can Find This eBook In

Non-FictionEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringElectronic Devices & MaterialsSemi-Conductors & Super-ConductorsMechanical Engineering & MaterialsMaterials ScienceCircuits & ComponentsIndustrial Chemistry & Manufacturing TechnologiesCommunications Engineering & Telecommunications

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