3D IC Stacking Technology

By: Banqiu Wu, Ajay Kumar, Sesh Ramaswami

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Hardcover | 14 July 2011 | Edition Number 1

At a Glance

Hardcover
544 Pages

Dimensions(cm)
23.62 x 16.0 x 2.31

Hardcover

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The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technology
Practical design ecosystem for heterogeneous 3D IC products
Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
Process integration for TSV manufacturing
High-aspect-ratio silicon etch for TSV
Dielectric deposition for TSV
Barrier and seed deposition
Copper electrodeposition for TSV
Chemical mechanical polishing for TSV applications
Temporary and permanent bonding
Assembly and test aspects of TSV technology

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