(Ipf)Microelectronic Reliability

Reliability, Test and Diagnostics v. 1

By: Edward B. Hakim

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Hardcover | 31 January 1989

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Hardcover
396 Pages

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24.13 x 16.51 x 2.54

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Text/reference spaning the theoretical concepts of reliability models and failure distributions, to GaAs microcircuit processing and test. Provides background on the development of quality assurance and verification procedures. Some of the new changes under development to cope with pressures brought

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Technology in General


Preface	p. xiii
Introduction	p. xv
Statistical Aspects for Reliability	p. 1
An Overview of the Role of Statistics	p. 1
Basic Notation and Terminology	p. 2
Concepts of Probability Distributions and Probability Densities	p. 3
Probability Distribution Functions	p. 4
Important Functions	p. 7
Statistical Measures	p. 11
Statistical Inference	p. 13
Distributions for Inference	p. 14
Estimation	p. 15
Hypothesis Testing	p. 16
The Central Limit Theorem	p. 19
Experimental Design	p. 20
The Sampling Process	p. 20
Selecting the Sample	p. 20
Sampling Procedures	p. 21
Failure Mechanisms in Microelectronic Devices	p. 25
Introduction	p. 25
Scope--Types of Microelectronic Devices	p. 26
Failure Modes and Failure Mechanisms	p. 28
Yield and Reliability	p. 29
Types of Stresses	p. 30
Failure Analysis	p. 31
Designing-in Reliability versus Screening	p. 33
Semiconductor Bulk Failure Mechanisms	p. 34
Second Breakdown	p. 34
Latch-Up	p. 34
Single-Event Upset	p. 36
Bulk Radiation Effects	p. 37
Chip Fracture	p. 38
Semiconductor-Dielectric Interface Failure Mechanisms	p. 38
Alkali Ion Migration	p. 39
Slow Trapping Instability	p. 40
Hot-Carrier Effects	p. 42
Surface Charge Spreading	p. 43
Polarization	p. 44
Ionizing Radiation Effects	p. 45
Dielectric Effects	p. 45
Time-Dependent Dielectric Breakdown	p. 46
Dielectric Wearout	p. 47
Fracture of Dielectric	p. 48
Passivation Layers	p. 48
Breakdown due to EOS or ESD	p. 49
Conductor and Metalization Failure Mechanisms	p. 50
Electromigration	p. 50
Failure at Microcracks	p. 53
Corrosion Effects	p. 54
Metal Migration	p. 55
Contact Spiking	p. 55
Hillock Formation	p. 56
Assembly and Packaging-Related Failure Mechanisms	p. 57
Failure Mechanisms in Die Bonds	p. 57
Wire Bonds	p. 57
Purple Plague	p. 58
Failure Mechanisms in Hermetically Sealed Packages	p. 59
Contaminant Effects	p. 59
Plastic Encapsulation-Related Failures	p. 60
Device Metal Pattern Distortion by Plastic	p. 61
Plastic-Induced Device Stress Effects	p. 61
Effects of Technology Trends	p. 61
Technology Trends	p. 62
Scaling to Smaller Dimensions	p. 62
Increased Device Complexity	p. 64
Tradeoffs	p. 64
Reliability Trends	p. 65
Testability for Functional Verification and Diagnostics	p. 89
Introduction	p. 89
Objective and Terminology for Digital Testing	p. 90
Definition of Most Frequently Used Terms	p. 90
Fault Models	p. 91
Testing Objectives	p. 95
Test Pattern Generation	p. 95
Test Pattern Validation	p. 96
Test Pattern Application	p. 100
Structured Design for Testability Techniques	p. 101
Level-Sensitive Scan Design (LSSD)	p. 102
Scan Path	p. 105
Scan-Set Logic	p. 106
Random Access Scan	p. 109
Incomplete Scan Path Design	p. 110
Built-in Self-Testing	p. 112
Signature Analysis	p. 114
Built-in Logic Block Observer	p. 123
Summary	p. 124
Automatic Testing	p. 129
Introduction	p. 129
Overview of Testing	p. 130
The Test Philosophy	p. 132
The Evolution of Test Engineering	p. 133
Automatic Testing and the ATE	p. 134
Introduction to Automatic Testing	p. 134
ATE Building Blocks	p. 134
Using an ATE	p. 140
The ATE Investment	p. 142
The IC Under Test	p. 144
Types of ICs	p. 145
Types of Tests	p. 147
Tester Independence	p. 151
Test Program Set Development	p. 153
What is a Test Program Set?	p. 153
Manual Test Generation	p. 154
Simulation	p. 157
Physical Emulation	p. 174
Automatic Test Generation	p. 177
Interfaces	p. 186
Summary of TPS Development	p. 191
ATE Economics	p. 191
Why Do ICs Fail?	p. 203
The Economics of IC Burn-In	p. 203
The Economics of Testability	p. 205
Summary of ATE Economics	p. 208
Summary	p. 208
Manufacturing Process Control	p. 215
Introduction	p. 215
Process Characterization	p. 217
Process Capability Studies	p. 219
Factors Internal to the Manufacturing Process	p. 220
External Sources of Variation	p. 223
Determining the Process Capability	p. 225
Major Steps in a Process Capability Study	p. 225
Control Charts	p. 229
Investigation of Out-of-Control Conditions	p. 234
Process Optimization	p. 235
Process and Product Control and Monitoring	p. 236
The Need for Control and Monitoring	p. 236
Process Control	p. 236
Statistical Sampling	p. 237
Process and Product Improvement	p. 238
GaAs Reliability and Test	p. 241
Technology Description	p. 241
Introduction	p. 241
Digital GaAs IC Structures	p. 243
GaAs MMIC Structures	p. 247
In-Process Test	p. 247
Test Structures	p. 249
Electrostatic Discharge Protection	p. 253
Digital GaAs ICs	p. 253
Digital Circuit Design with GaAs MESFETs	p. 253
Digital GaAs Circuit Packaging	p. 263
Digital Circuit Testing	p. 265
GaAs Microwave Circuits	p. 266
Introduction	p. 266
Components for GaAs MMICs	p. 266
Circuit Design	p. 280
RF Testing	p. 284
Reliability of GaAs Microelectronics	p. 286
Failure Mechanisms	p. 286
Radiation Effects	p. 296
Life Testing of GaAs ICs	p. 302
Advanced Failure Analysis Instrumentation	p. 313
List of Acronyms	p. 359
Glossary	p. 361
Index	p. 367
Table of Contents provided by Syndetics. All Rights Reserved.

(Ipf)Microelectronic Reliability

Reliability, Test and Diagnostics v. 1

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

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