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Results for author 'Beth Kesler'

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-Package - Beth Keser

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

High Performance Compute and System-in-Package

Beth Keser and Steffen Kr¿hnert

Hardcover

RRP $276.05

$275.75

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