Engineering Materials and Processes

Stability and Reliability

By: Daniel Adams, Terry L. Alford, James W. Mayer

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Paperback | 14 March 2012

At a Glance

Paperback
136 Pages

Dimensions(cm)
23.39 x 15.6 x 0.74

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With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability issues and the processing issues that have prevented silver from being used as an interconnect metal. Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. The authors provide details on a wide range of experimental, characterization, and analysis techniques. In addition, they discuss novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.

Industry Reviews

From the reviews:

"This book is aimed at addressing and reviewing the engineering aspects of improving the thermal and electrical stability of silver with a view to use as an interconnect material in integrated circuits. ... this book can provide a quick overview of the state of the art, current trends and hurdles yet to be overcome." (Contemporary Physics, Vol. 51 (6), 2010)

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