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Wafer Bonding : Applications and Technology - Marin Alexe

Wafer Bonding

Applications and Technology

By: Marin Alexe (Editor), Ulrich Gosele (Editor)

Hardcover

Published: 1st June 2004
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s ... . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

Direct bonding, fusion bonding, anodic bonding, wafer bonding : a historical patent picture of the worldwide moving front of the state-of-the-art of contact bondingp. 1
Basics of silicon-on-insulator (SOI) technologyp. 61
Silicon-on-insulator by the Smart Cut processp. 85
ELTRAN technology based on wafer bonding and porous siliconp. 107
Wafer bonding for high-performance logic applicationsp. 157
Application of bonded wafers to the fabrication of electronic devicesp. 193
Compound semiconductor heterostructures by Smart Cut : SiC on insulator, QUASIC substrates, InP and GaAs heterostructures on siliconp. 263
Three-dimensional photonic bandgap crystals by wafer bonding approachp. 315
Wafer direct bonding for high-brightness light-emitting diodes and vertical-cavity surface-emitting lasersp. 327
High-density hybrid integration of III-V compound optoelectronics with silicon integrated circuitsp. 359
Layer transfer by bonding and laser lift-offp. 377
Single-crystal lithium niobate films by crystal ion slicingp. 417
Wafer bonding of ferroelectric materialsp. 451
Debonding of wafer-bonded interfaces for handling and transfer applicationsp. 473
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9783540210498
ISBN-10: 3540210490
Series: Springer Series in Materials Science
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 504
Published: 1st June 2004
Publisher: Springer-Verlag Berlin and Heidelberg Gmbh & Co. Kg
Country of Publication: DE
Dimensions (cm): 23.5 x 15.5  x 1.91
Weight (kg): 1.03