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Thermal Management Handbook : For Electronic Assemblies - Jerry Sergent

Thermal Management Handbook

For Electronic Assemblies

Hardcover

Published: 1st May 1998
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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges -- and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage -- and preventing thermal-related problems from occurring in the first place.

Introduction
Electronic Packaging Technology
Thermal Properties of Electronic Materials
Heat Generation in Electronic Circuits
Basic Thermal Analysis
Thermal Analysis of Electronic Assemblies
Cooling of Electronic Assemblies
Data
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780070266995
ISBN-10: 0070266999
Series: Electronic Packaging and Interconnection Series
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 650
Published: 1st May 1998
Publisher: McGraw-Hill Education - Europe
Country of Publication: US
Dimensions (cm): 23.6 x 15.6  x 3.0
Weight (kg): 0.7
Edition Number: 1