Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
Number Of Pages: 400
Published: 14th April 1993
Country of Publication: US
Dimensions (cm): 23.1 x 15.65 x 2.84
Edition Number: 1