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Structural Integrity and Reliability in Electronics : Enhancing Performance in a Lead-Free Environment - W.J. Plumbridge

Structural Integrity and Reliability in Electronics

Enhancing Performance in a Lead-Free Environment

Hardcover

Published: 31st December 2003
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Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.

Preface
About the authors
The Materials Perspectivep. 1
Setting the Scenep. 3
Introduction to the Properties of Materialsp. 19
More Complex Mechanical Behaviourp. 33
Mechanical Testing (For Electronics Applications)p. 51
Mechanical Properties of Bulk Soldersp. 69
Mechanical Behaviour of Solder Jointsp. 99
The Manufacturer's Perspectivep. 117
Electronic Components and their Constructionp. 119
Printed Circuit Board Assembly Methods and Technologiesp. 149
Fundamentals of Failure Analysisp. 167
Analysis of PCB and Electronic Component Failurep. 183
Making the Transition to a Reliable Lead-Free Solder Processp. 205
The Designer's Perspectivep. 215
Introduction to Life Predictionp. 217
Life Prediction by Crack Propagation Approachp. 239
Reliability and Statistical Analysis of Datap. 257
Thermal and Mechanical Simulation in Microelectronicsp. 275
Finite Element Analysisp. 287
Non-Linear Finite Element Analysisp. 305
Case Studyp. 319
Indexp. 331
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9781402017650
ISBN-10: 1402017650
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 336
Published: 31st December 2003
Publisher: Springer-Verlag New York Inc.
Country of Publication: US
Dimensions (cm): 23.5 x 15.5  x 1.91
Weight (kg): 0.77