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Silicon Microchannel Heat Sinks : Theories and Phenomena - L. Zhang

Silicon Microchannel Heat Sinks

Theories and Phenomena

Hardcover Published: 26th November 2003
ISBN: 9783540401810
Number Of Pages: 141

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There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Introductionp. 1
Two-phase Microchannel Heat Sinks: Problems and Challengesp. 13
A Thermal Experimental System with Freestanding Microchannelsp. 33
Measurements and Modeling of Two-phase Flow in Microchannelsp. 55
Boiling Regimes and Transient Signals Associated with the Phase Changep. 73
Enhanced Nucleate Boiling in Microchannelsp. 95
Conclusionsp. 119
Process Flow Chart for Single-channel Devices with Combined Heater and Thermometersp. 127
Process Flow Chart for Single-channel Devices with Separate Heater and Thermometersp. 129
Referencesp. 131
Indexp. 139
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9783540401810
ISBN-10: 3540401814
Series: Microtechnology and Mems
Audience: General
Format: Hardcover
Language: English
Number Of Pages: 141
Published: 26th November 2003
Publisher: SPRINGER VERLAG GMBH
Country of Publication: DE
Dimensions (cm): 23.37 x 16.0  x 1.52
Weight (kg): 0.36

Earn 441 Qantas Points
on this Book