Recent Trends in VLSI and Semiconductor Packaging

Name: Recent Trends in VLSI and Semiconductor Packaging
Brand: Taylor & Francis
Price: 104.5 AUD
Availability: PreOrder

By: T. Vasudeva Reddy (Editor), K. Madhava Rao (Editor)

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eText | 6 May 2025 | Edition Number 1

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The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.