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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications : Electronic Packaging and Interconnects Series - Dean L. Monthei

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects Series

Hardcover

Published: 30th November 1998
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modeling as a significant cost-cutting tool is high. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging will find this book interesting and of great value to their work.

Preface
Tutorial on Microwave Conceptsp. 3
The Smith Chart and S-Parametersp. 29
Equivalent Circuit Modelsp. 45
Creating Models from Measurementsp. 63
Creating a Model using EM Simulatorsp. 85
Basics of Thermal Analysisp. 121
Quick Thermal Analysisp. 133
Finite Element Analysisp. 141
Computational Fluid Dynamicsp. 151
Transient Thermalp. 155
Thermal Measurementsp. 165
Package Families for Wirelessp. 173
Optimizing Electrical Performancep. 181
Production Process Issuesp. 191
Die Attach Issuesp. 206
Electrical Conductivities of Packaging Materialsp. 211
Dielectric Properties of Packaging Materialsp. 213
Thermal Conductivities of Packaging Materialsp. 215
Thermal Modeling Software and Informationp. 217
Thermal Analysis Equipment and Materialsp. 219
Electromagnetic Simulator Softwarep. 221
Electrical Probing Toolsp. 223
Circuit Simulator Softwarep. 225
Indexp. 226
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9780792383642
ISBN-10: 0792383648
Series: Electronic Packaging and Interconnects Series
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 234
Published: 30th November 1998
Publisher: Springer
Country of Publication: NL
Dimensions (cm): 24.77 x 17.15  x 1.91
Weight (kg): 0.54