| Foreword | p. xi |
| Preface | p. xv |
| Motivational Aspects: An Introduction to Optical Interconnection | |
| An Introduction to Optical Interconnection | p. 3 |
| Information Processing's Dependence Upon Connectivity | p. 3 |
| The Evolution of Optical Interconnection Technology | p. 4 |
| More Contemporary Issues | p. 5 |
| At the Device Level | p. 5 |
| At the System Level | p. 6 |
| Organization of the Book | p. 7 |
| References | p. 8 |
| Formalism of the Current Interconnect Bottleneck | p. 9 |
| Introduction | p. 9 |
| Interconnect Bottleneck in Conventional Microelectronic Systems | p. 9 |
| Advantages of Optical Interconnects | p. 13 |
| Power-Speed Tradeoff Analysis | p. 14 |
| Chip-Level Interconnects | p. 15 |
| MCM-Level Interconnects | p. 35 |
| Connection Density Analysis | p. 42 |
| Introduction | p. 42 |
| Lower Boundaries on Interconnect Area | p. 43 |
| Interconnect Area Upper Boundaries for Specific Optical Architectures | p. 50 |
| Discussion | p. 55 |
| Conclusions | p. 59 |
| References | p. 60 |
| Current Optical Interconnection Approaches and Limitations | |
| Bulk Waveguide Routing--Fiber Optics | p. 65 |
| Introduction | p. 65 |
| Intrashelf Communication | p. 69 |
| Intershelf Communication | p. 75 |
| System Backplane Requirements | p. 76 |
| Fiber Embedded Substrate Technology | p. 77 |
| Rigid Substrates | p. 78 |
| Flexible Substrates | p. 82 |
| Technology Capabilities and Limitations | p. 84 |
| Fiber Array Connector Capabilities | p. 85 |
| Interconnection Density and Fiber Packaging Issues | p. 89 |
| Passive and Active (Rare Earth-Doped) Fiber Backplane Networks | p. 90 |
| Environmental Ruggedness Issues | p. 96 |
| Summary | p. 98 |
| References | p. 99 |
| Free-Space Routing | p. 103 |
| Introduction | p. 103 |
| Free-Space Optical Routing Components and Architectures | p. 110 |
| Network Implementations | p. 117 |
| Spatial Light Modulators and Processor-Related Issues | p. 128 |
| Laser Optical Power Supplies and System Diagnostic Tools | p. 135 |
| Summary | p. 137 |
| References | p. 138 |
| Further Reading | p. 139 |
| Integrated Optical Waveguide Routing--Micro-optics | p. 141 |
| Introduction | p. 141 |
| Optical Waveguides | p. 143 |
| Introduction | p. 143 |
| Properties of Guided Waves | p. 144 |
| Slab Waveguides | p. 151 |
| Channel Waveguides | p. 160 |
| Planar Medium | p. 166 |
| Waveguide Fabrication | p. 167 |
| Waveguide Couplers | p. 177 |
| Coupling of Laser Diode Beam into Fiber | p. 178 |
| Fiber-Waveguide Coupling | p. 180 |
| Other Transversal Coupling Schemes | p. 185 |
| Waveguide Lenses | p. 185 |
| Active Guided Wave Devices | p. 193 |
| Electrooptic Waveguide Devices | p. 195 |
| Acoustooptic Modulators | p. 211 |
| Magnetooptic Modulators | p. 218 |
| Conclusions | p. 220 |
| References | p. 222 |
| Optoelectronic Interconnects and Electronic Packaging | p. 227 |
| Introduction | p. 227 |
| Design and Implementation Considerations | p. 228 |
| Material and Processing Requirements | p. 236 |
| Electronics for Integration | p. 237 |
| Integrated Optoelectronic Detectors and Receivers | p. 237 |
| Integrated Optoelectronic Transmitters | p. 240 |
| Packaging | p. 244 |
| References | p. 252 |
| Applications of Optical Interconnects | |
| Polymer-Based Photonic Integrated Circuits and Their Applications in Optical Interconnects and Signal Processing | p. 255 |
| Introduction | p. 255 |
| Formation of Polymer Microstructure Waveguides | p. 256 |
| Formation of Linear and Curved Channel Waveguide Array | p. 260 |
| Formation of Waveguide Holograms by Local Sensitization with Applications to WDM | p. 264 |
| x[superscript 2] Electrooptic Polymer | p. 268 |
| Rare Earth Ion-Doped (REI) Polymer Waveguide Amplifier | p. 272 |
| Polymer-Based Electrooptic Waveguide Modulator | p. 279 |
| Fanout Density and Optical Interconnection | p. 281 |
| Reliability Test | p. 284 |
| Further Applications | p. 287 |
| Nonlinear All Optical Switch | p. 287 |
| Systolic Arrays for Optical Computing | p. 288 |
| Position Sensor | p. 289 |
| Conclusions | p. 290 |
| References | p. 291 |
| Optical Interconnection for use in Hostile Environments | p. 295 |
| Introduction | p. 295 |
| Optical Interconnection Applications in Hostile Environments--A Brief Overview | p. 296 |
| Backplane Interconnection Applications | p. 296 |
| Smart Skins and Structures | p. 297 |
| Additional Candidates for Embedding | p. 298 |
| Case Example 1: Extraction of Cryogenically Generated Signals | p. 299 |
| Problems with Proposed Integrated Optical Cryogenic Coupler | p. 314 |
| One Solution to the Leaked Channel Light | p. 314 |
| Inefficient Handling of Unused Channel Optical Power Solution: Recycle Light | p. 315 |
| Case Example 2: MCM High Bandwidth Interconnections | p. 316 |
| References | p. 318 |
| An Approach for Implementing Reconfigurable Optical Interconnection Networks for Massively Parallel Computing | p. 319 |
| A 3-D Integrated Optical Computer Architecture | p. 320 |
| Large Guided-Wave Networks | p. 324 |
| Network Analysis | p. 326 |
| Crossbar Networks | p. 328 |
| n-Stage Network | p. 331 |
| Multistage Interconnection Networks | p. 332 |
| Duobanyan Network | p. 336 |
| Benes Network | p. 338 |
| Active and Passive Splitter/Combiner Networks | p. 340 |
| Comparison of Networks | p. 344 |
| A 3-D Integrated Optical Crossbar Network | p. 347 |
| System Operation | p. 351 |
| Conclusion | p. 353 |
| References | p. 354 |
| Theoretical Analysis for Cryogenic Coupler's Usable Dynamic Range (Per Channel) | p. 357 |
| List of Acronyms | p. 367 |
| About the Authors | p. 371 |
| Index | p. 377 |
| Table of Contents provided by Syndetics. All Rights Reserved. |
