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Modeling and Application of Flexible Electronics Packaging - YongAn Huang

Modeling and Application of Flexible Electronics Packaging

Hardcover Published: 7th May 2019
ISBN: 9789811336263
Number Of Pages: 287

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.


ISBN: 9789811336263
ISBN-10: 9811336261
Audience: General
Format: Hardcover
Language: English
Number Of Pages: 287
Published: 7th May 2019
Publisher: SPRINGER VERLAG GMBH
Country of Publication: SG
Dimensions (cm): 23.39 x 15.6  x 1.91
Weight (kg): 0.61

Earn 513 Qantas Points
on this Book