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Lia Handbook of Laser Materials Processing - J.F. Ready

Lia Handbook of Laser Materials Processing

By: J.F. Ready (Editor), D. Farson (Editor), T.M. Feeley (Editor)

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Published by the Laser Institute of America, The LIA Handbook of Laser Materials Processing is a working reference source designed to help solve problems by providing extensive data on procedures, processes, equipment, processing systems and processing results.The basic information about the various laser materials processing technologies presented here can help you determine:- Their potential effectiveness for your application.- Their capabilities and limitations.- Their requirements.- The numerical values for the laser parameters.- The numerical values for the processing results (i.e., penetration depth and processing rates for specified conditions of irradiation).

Industry Reviews

From the reviews of the first edition:

"This handbook is for engineers, materials scientists, optical scientists and physicists. It is designed to help solve problems in laser processing of metals, ceramics and other materials. The book contains a great deal of basic as well as advanced information and covers a broad range of pertinent topics: materials, instruments, procedures, industrial and laboratory equipment, monitoring, processes, processing systems, processing results and prototyping. ... The book should not be missed in laboratories dealing with laser processing." (P. K. Sherman, Optik, Vol. 114 (4), 2003)

Overview of Laser Materials Processing Lasers for Materials Processing
Optics and Optical Systems
Components for Laser Materials Processing Systems
Laser -Material Interactions
Hazards and Safety Considerations
Surface Treatment: Heat Treatment
Surface Treatment: Glazing, Remelting, Alloying, Cladding and Cleaning
Conduction Welding
Penetration Welding
Laser Cutting
Hole Drilling
Rapid Prototytping
Rapid Prototytping
Laser Marking/Branding
Link Cutting/Marking
Applications in Photolithography
Flat Panel Display
High-Temperature Superconductors (HTSC)
Laser Produced Microstructures
Electronic Packaging: Electronic Interconnects
Electronic Packaging: Package Sealing and Ceramic
Film Deposition and Doping
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9783540417705
ISBN-10: 3540417702
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 715
Country of Publication: DE
Dimensions (cm): 27.9 x 21.0  x 6.3
Weight (kg): 2.04