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Industrial Plasma Engineering : Volume 2 - Applications to Nonthermal Plasma Processing - J. Reece Roth

Industrial Plasma Engineering

Volume 2 - Applications to Nonthermal Plasma Processing

Paperback

Published: 1st August 2001
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Written by a leading expert in the field, the paperback edition of Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices that are of commercial interest. The text is suitable for students or in-service users with a physics and calculus background at the sophomore level. These two volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines and as a reference source by in-service engineers.

Contents, Volume 1: Principlesp. viii
Preface to Volume 2p. ix
Surface Interactions in Plasma Processingp. 1
Industrial Plasma Processingp. 1
Plasma Active Speciesp. 6
Heterogeneous Interactions with Surfacesp. 9
Secondary Electron Emissionp. 15
Sputteringp. 17
Ion Implantation in Solidsp. 31
Referencesp. 35
Atmospheric Pressure Plasma Sourcesp. 37
Characteristics of Industrial Plasma Sourcesp. 38
Atmospheric Pressure Corona Sourcesp. 46
Atmospheric Dielectric Barrier Discharges (DBDs)p. 50
The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP)p. 55
Arcjet Plasma Sourcesp. 65
Inductively Coupled Plasma Torchesp. 69
Referencesp. 72
Vacuum Plasma Sourcesp. 74
Intermediate-Pressure Plasma Sourcesp. 74
Low-Pressure Plasma Sourcesp. 93
High-Vacuum Plasma Sourcesp. 108
Summary of Plasma Source Parametersp. 109
Referencesp. 110
Plasma Reactors for Plasma Processingp. 113
Plasma Reactors for Surface Treatmentp. 115
Plasma Reactors for Ion Implantationp. 139
Reactors for Ion-Beam-Induced Sputter Depositionp. 146
Plasma/Cathode Sputter Deposition Reactorsp. 157
Reactors for Plasma Chemical Vapor Depositionp. 167
Plasma Etching Reactorsp. 179
Referencesp. 193
Specialized Techniques and Devices for Plasma Processingp. 196
Vacuum System Operationp. 196
Workpiece Current Collectionp. 200
Remote Exposure Configurationsp. 205
Motional Averaging to Achieve Uniformity of Effectp. 211
Gas Flow Distributionp. 219
Electrohydrodynamic (EHD) Flow Controlp. 225
Referencesp. 239
Parametric Plasma Effects On Plasma Processingp. 240
The Role of the Plasmap. 240
Kinetic Parameters of Plasma Processingp. 243
RF Power Couplingp. 249
Sheath Thickness Above Workpiecep. 255
RF Sheath Phenomenologyp. 263
Formation of Active Speciesp. 271
The Effect of Electron Magnetization on Active-Species Concentrationp. 277
Referencesp. 283
Diagnostics for Plasma Processingp. 284
Experimental Parametersp. 284
Gas-Phase Process Monitoringp. 286
Plasma Diagnosticsp. 295
Measurement of Surface Topographyp. 313
Measurement of Surface Compositionp. 315
Surface Energy Related Diagnosticsp. 318
Measurement of Electrical Propertiesp. 325
In Situ Process Monitoringp. 328
Endpoint Detectionp. 332
Referencesp. 333
Plasma Treatment of Surfacesp. 335
Objectives of Plasma Surface Treatmentp. 335
Passive Plasma Cleaningp. 341
Active Plasma Cleaningp. 352
Plasma Sterilizationp. 360
Treatment of Thin Filmsp. 369
Treatment of Polymeric or Organic Solidsp. 376
Treatment of Fabrics and Fibersp. 383
Referencesp. 396
Surface Modification by Implantation and Diffusionp. 399
Ion Implantation Technologyp. 399
Ion Implantation Dose and Depth Profilesp. 403
Ion-Beam Implantationp. 411
Plasma Ion Implantationp. 421
Low-Energy Plasma Thermal Diffusion Treatmentp. 443
Referencesp. 448
Thin-Film Deposition by Evaporative Condensation and Sputteringp. 451
Applications of Thin Filmsp. 451
Thin-Film Characteristicsp. 461
Deposition by Evaporative Condensationp. 471
Ion-Beam Sputter Depositionp. 477
Plasma-Assisted Ion-Beam Sputter Depositionp. 490
Plasma/Cathode Sputter Depositionp. 495
Quality Issues in Sputter Depositionp. 499
Referencesp. 500
Plasma Chemical Vapor Deposition (PCVD)p. 502
Thin-Film Deposition by PCVDp. 502
Physical and Chemical Processes in PCVD Glow Dischargesp. 510
Characteristics of Polymeric Thin Films Formed by PCVDp. 517
Glow Discharge Polymerizationp. 528
Glow Discharge Reactors for PCVDp. 531
Summary of Deposition Reactor Plasma Parametersp. 537
Referencesp. 538
Plasma Etchingp. 540
Survey of Plasma Etchingp. 540
Pattern Transfer by Plasma-Related Etchingp. 551
Control Variables for Plasma Etchingp. 573
The Chemistry of Plasma Etchingp. 578
Plasma Etching of Microelectronic Materialsp. 597
Technical Issues in Plasma Etchingp. 605
Referencesp. 612
Appendicesp. 614
Nomenclaturep. 614
Physical Constantsp. 623
Units and Conversion Factorsp. 624
Useful Formulaep. 626
Indexp. 628
Table of Contents provided by Syndetics. All Rights Reserved.

ISBN: 9780750305457
ISBN-10: 0750305452
Series: Industrial Plasma Engineering : Book 2
Audience: Professional
Format: Paperback
Language: English
Number Of Pages: 660
Published: 1st August 2001
Publisher: Taylor & Francis Ltd
Country of Publication: GB
Dimensions (cm): 22.86 x 15.88  x 3.81
Weight (kg): 0.91
Edition Number: 2