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Hybrid Assemblies and Multichip Modules : Mechanical Engineering (Marcel Dekker Hardcover) - Fred W. Kear

Hybrid Assemblies and Multichip Modules

Mechanical Engineering (Marcel Dekker Hardcover)

Hardcover

Published: 1st January 1992
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Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. Examining the current state of hybrid assembly technology, "Hybrid Assemblies and Multichip Modules": provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components. Focusing primarily on electronic assemblies that use ceramic substrates, "Hybrid Assemblies and Multichip Modules" should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

An overview of hybrid assemblies
Design and development of hybrid assemblies
Ceramic substrates
Thick-film and thin-film circuits
Screened passive components
Surface-mount components
Interconnection technologies
Component placement and soldering
Testing methods
Coating
Encapsulating and marking
Installing and using the hybrid assembly
Quality assessment of hybrid assemblies
Microchip modules
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780824784669
ISBN-10: 0824784669
Series: Mechanical Engineering (Marcel Dekker Hardcover)
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 296
Published: 1st January 1992
Publisher: TAYLOR & FRANCIS
Country of Publication: US
Dimensions (cm): 23.42 x 16.31  x 2.46
Weight (kg): 0.64
Edition Number: 1