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Handbook of Advanced Plasma Processing Techniques - R. J. Shul

Handbook of Advanced Plasma Processing Techniques

By: R. J. Shul (Editor), S. J. Pearton (Editor)

Hardcover Published: 28th August 2000
ISBN: 9783540667728
Number Of Pages: 655

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Pattern transfer by dry etching and plasma-enhanced chemical vapor de­ position are two of the cornerstone techniques for modern integrated cir­ cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen­ sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi­ als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.

Some Fundamental Aspects of Plasma-Assisted Etchingp. 1
Plasma Fundamentals for Materials Processingp. 33
Plasma Modelingp. 69
Plasma Reactor Modelingp. 123
Overview of Plasma Diagnostic Techniquesp. 145
Mass Spectrometric Characterization of Plasma Etching Processesp. 205
Fundamentals of Plasma Process-Induced Charging and Damagep. 257
Surface Damage Induced by Dry Etchingp. 309
Photomask Etchingp. 361
Bulk Si Micromachining for Integrated Microsystems and MEMS Processingp. 419
Plasma Processing of III-V Materialsp. 459
Ion Beam Etching of Compound Semiconductorsp. 507
Dry Etching of InP Viasp. 549
Device Damage During Low Temperature High-Density Plasma Chemical Vapor Depositionp. 575
Dry Etching of Magnetic Materialsp. 607
Subject Indexp. 649
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9783540667728
ISBN-10: 3540667725
Audience: General
Format: Hardcover
Language: English
Number Of Pages: 655
Published: 28th August 2000
Publisher: SPRINGER VERLAG GMBH
Country of Publication: DE
Dimensions (cm): 23.88 x 16.51  x 3.12
Weight (kg): 1.05

Earn 836 Qantas Points
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