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Failure Analysis of Integrated Circuits : Tools and Techniques - Lawrence C. Wagner

Failure Analysis of Integrated Circuits

Tools and Techniques

By: Lawrence C. Wagner (Editor)

Hardcover Published: 31st January 1999
ISBN: 9780412145612
Number Of Pages: 255

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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Electrical Characterization
Package Analysis: SAM and X-Ray
Die Exposure
Global Failure Site Isolation: Thermal Techniques
Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques
Probing Technology for IC Diagnosis
Cross-Section Analysis
Inspection Techniques
Chemical Analysis
Energy Dispersive Spectroscopy
Auger Electron Spectroscopy
Secondary Ion Mass Spectrometry, SIMS
Failure Analysis Future Requirements
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780412145612
ISBN-10: 0412145618
Series: The Springer International Series in Engineering and Computer Science
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 255
Published: 31st January 1999
Publisher: Chapman and Hall
Country of Publication: GB
Dimensions (cm): 23.5 x 15.5  x 2.21
Weight (kg): 0.59