+612 9045 4394
 
CHECKOUT
Failure Analysis of Integrated Circuits : Tools and Techniques - Lawrence C. Wagner

Failure Analysis of Integrated Circuits

Tools and Techniques

By: Lawrence C. Wagner (Editor)

Hardcover

Published: 31st January 1999
Ships: 7 to 10 business days
7 to 10 business days
RRP $631.99
$437.75
31%
OFF
or 4 easy payments of $109.44 with Learn more
if ordered within

Other Available Formats (Hide)

  • Paperback View Product Published: 9th November 2012
    $293.53

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Preface
Introduction
Electrical Characterization
Package Analysis: SAM and X-Ray
Die Exposure
Global Failure Site Isolation: Thermal Techniques
Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques
Probing Technology for IC Diagnosis
Deprocessing
Cross-Section Analysis
Inspection Techniques
Chemical Analysis
Energy Dispersive Spectroscopy
Auger Electron Spectroscopy
Secondary Ion Mass Spectrometry, SIMS
Failure Analysis Future Requirements
Index
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780412145612
ISBN-10: 0412145618
Series: The Springer International Series in Engineering and Computer Science
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 255
Published: 31st January 1999
Publisher: Chapman and Hall
Country of Publication: GB
Dimensions (cm): 23.5 x 15.5  x 2.21
Weight (kg): 0.59