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Electrothermal Analysis of VLSI Systems - Yi-Kan Cheng

Electrothermal Analysis of VLSI Systems

Hardcover Published: 30th June 2000
ISBN: 9780792378617
Number Of Pages: 210

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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

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From the Foreword:

`Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.'
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation

List of Figures
List of Tables
Preface
Acknowledgments
The Building Blocks
Introduction
Power Analysis for CMOS Circuits
Temperature-Dependent MOS Device Modeling
Thermal Simulation for VLSI Systems
Fast-Timing Electrothermal Simulation
The Applications
Temperature-Dependent Electromigration Reliability
Temperature-Driven Cell Placement
Temperature Driven Power and Timing Analysis
Index
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780792378617
ISBN-10: 079237861X
Audience: General
Format: Hardcover
Language: English
Number Of Pages: 210
Published: 30th June 2000
Publisher: Springer
Country of Publication: US
Dimensions (cm): 23.39 x 15.6  x 1.42
Weight (kg): 0.51

Earn 587 Qantas Points
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