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Electronics Reliability and Measurement Technology : Nondestructive Evaluation :  Nondestructive Evaluation - Joseph S. Heyman

Electronics Reliability and Measurement Technology : Nondestructive Evaluation

Nondestructive Evaluation

Hardcover Published: June 1998
ISBN: 9780815511717
Number Of Pages: 140

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This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Measurement Science and Manufacturing Science Research
Nondestructive SEM for Surface and Subsurface Wafer Imaging
Surface Inspection-Research and Development
Wafer Level Reliability for High-Performance VLSI Design
Wafer Level Reliability Testing: an Idea Whose Time Has Come
Micro-Focus X-Ray Imaging
Measurement of Opaque Film Thickness
Intelligent Laser Soldering Inspection and Process Control
Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
""Whole Wafer"" Scanning Electron Microscopy
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780815511717
ISBN-10: 081551171X
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 140
Published: June 1998
Country of Publication: US
Dimensions (cm): 25.4 x 17.81  x 0.97
Weight (kg): 0.47