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Directions for the Next Generation of MMIC Devices and Systems : The Language of Science - Nirod K. Das

Directions for the Next Generation of MMIC Devices and Systems

The Language of Science

By: Nirod K. Das (Editor), Henry L. Bertoni (Editor)

Hardcover

Published: 30th November 1997
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Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel,and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on the series ofsymposia sponsored by the Weber Research Institute of Polytechnic University, an international symposium focusing on the current developments and new research initiatives for the next generation ofmicrowave and millimeter wave inte- grated circuits and systems was held at Brooklyn, New York,during September 11-13, 1996. The symposium was organizedas a3-dayevent,running mostly ina single-session format of regular papers and panel discussions, It was co-sponsored by the Army Research Office, Re- search Triangle Park, NC, in cooperation with the IEEE Microwave Theory and Techniques Society, the IEEE Antennas and Propagation Society, and IEEE Long Island and New York MetropolitanSections.The papers published in this volume are extended versionsofselected papers presented at this symposium.

Scanning the Conferencep. 3
Historical Perspectives on Microwave and Millimeter-Wave Integrated Circuitsp. 5
MAFET THRUST 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Powerp. 19
Future Directions in MMIC Research and Technology: The Wireless Pullp. 31
High-Density Microwave Packaging Technology Development for Department of Defense Applicationsp. 37
Flip Chip Power MMIC's Packaging Technologyp. 45
Multilayer Vertical Interconnection Technologyp. 53
Multilevel Packaging for Low Cost Microwave Functionsp. 61
Future Applicators of Millimeter Technologyp. 69
Distributed Power Combining and Signal Processing in a 2-D Quasioptical Systemp. 75
Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Design Considerationsp. 83
The Hybrid Integration Technique of Planar and NRD-Guide Circuits for Millimeter-Wave Applicationsp. 97
Solder Free Interconnects for High Density Phased Array Integrationp. 105
Silicon-Based On-Wafer and Discrete Packagingp. 113
Patch-MMIC-Ferrite Integration in Novel Phased-Array Technologyp. 121
Broadbanding Guide-Lines of Strip-Element Microstrip Phased Arraysp. 131
U-Slot Patch Wideband Microstrip Antennap. 145
Surface-Wave Mode Reduction of Rectangular Microstrip Antennas on High-Index Materialsp. 153
Integrated Strip Gratings on Top of Microstrip Antennas and Arrays for Low and Ultra-Low Cross-Polar Radiationp. 161
A New Type of Dual Band Microstrip Array Fed by a Purely TEM Feeding Networkp. 175
The Integrated Dielectric Slab Waveguide-Wedge Antennap. 181
Dual-Polarized Rectangular Resonator Antennap. 197
SiGe MMIC's - on the Current State-of-the-Artp. 205
FM Noise and Synchronization Behavior of a SIMMWIC 76.5 GHz Front Endp. 209
Experimental and Numerical Results on High-Frequency Noise of Si/SiGe HBT'sp. 217
The Development of Si and SiGe Technologies for Microwave and Millimeter-Wave Integrated Circuitsp. 223
94 Ghz Schottky Detector with CMOS Preamplifierp. 231
Semiconductor Waveguide Components for Analog Fiber-Optic Linksp. 239
Microwave Photonic Links with Very Low ([actual symbol not reproducible]3dB) Amplifierless Noise Figurep. 245
Polymer Optical Waveguides for Multi-Chip Modulesp. 255
Low-Voltage MMIC-HBT VCO For Millimeter-Wave Communication Systemsp. 263
A Triple-Gate MESFET Voltage Variable Attenuator for Millimeter-Wave Applicationsp. 271
Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Linesp. 281
2-D Integral Spectral-Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Linesp. 299
Excitation of Leaky Modes on Printed-Circuit Structures by Practical Feeds: An Investigation of Physical Meaningp. 307
Complex Characteristic Impedance of a Leaky Printed Transmission Line: Alternative Analysis Methodsp. 315
Suppression of Leakage in Printed Transmission Lines Using Finite-Width Dielectric Loadingp. 323
Electromagnetic Simulation of High Speed and RF Multi-Chip Modules - An Overviewp. 331
Microstrip Antenna Analysis using a Suite of Modeling Techniques - A Reviewp. 339
A New Approach to the Design of Microwave Amplifiersp. 351
Boardband Characteristics of Representative Circuit-to-Circuit Interconnectionsp. 361
Speculations on the Next Ten Years in Electromagnetic Field Simulationp. 381
ANN and Knowledge-Based Approaches for Microwave Designp. 389
CAD Needs for Flip Chip Coplanar Waveguide Monolithic Microwave Integrated-Circuit Technologyp. 397
Computer Aided Design Tools for Microstrip Circuitriesp. 399
Matching and Compensation Network Synthesis for MMIC'sp. 407
Indexp. 413
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9780306457692
ISBN-10: 0306457695
Series: The Language of Science
Audience: Professional
Format: Hardcover
Language: English
Number Of Pages: 415
Published: 30th November 1997
Publisher: Springer Science+Business Media
Country of Publication: US
Dimensions (cm): 26.67 x 18.42  x 3.18
Weight (kg): 0.95