| Preface | p. xix |
| Contributors | p. xxiii |
| Introduction to Direct-Write Technologies for Rapid Prototyping | p. 1 |
| Direct-Write Technologies | p. 1 |
| Electronics | p. 3 |
| Biomaterials | p. 9 |
| Miscellaneous Application Areas | p. 11 |
| Conclusions | p. 11 |
| Applications | |
| Overview of Commercial and Military Application Areas in Passive and Active Electronic Devices | p. 17 |
| Introduction | p. 17 |
| Direct-Write Electronic Component Manufacturing | p. 18 |
| Making Direct-Write Processes a Reality | p. 20 |
| Applications of Direct-Write Manufacturing | p. 24 |
| Conclusions | p. 29 |
| Role of Direct-Write Tools and Technologies for Microelectronic Manufacturing | p. 33 |
| Introduction | p. 33 |
| Direct-Write Technology in the Microelectronics Industry | p. 35 |
| Next Generation System | p. 46 |
| Technology Diffusion in Microelectronic Industry | p. 50 |
| Conclusions | p. 54 |
| Direct-Write Materials and Layers for Electrochemical Power Devices | p. 55 |
| Introduction | p. 55 |
| Background | p. 57 |
| Need for Direct-Write Layers | p. 63 |
| Materials for Metal-Air Batteries and PEM Fuel Cells | p. 76 |
| Direct-Write Layers for Battery and Fuel Cell Applications | p. 80 |
| Conclusions | p. 91 |
| The Role of Direct Writing for Chemical and Biological Materials: Commercial and Military Sensing Applications | p. 93 |
| Introduction | p. 93 |
| Chemical Microsensors | p. 97 |
| Biosensors and Microwell Technology | p. 103 |
| Coating Techniques for Sensing Applications | p. 106 |
| Case Studies | p. 111 |
| Summary | p. 116 |
| Materials | |
| Advanced Materials Systems for Ultra-Low-Temperature, Digital, Direct-Write Technologies | p. 123 |
| Introduction | p. 123 |
| Deposition Methods and Associated Materials Requirements | p. 133 |
| Super-Low-Fire Inks and Pastes | p. 141 |
| Conductors | p. 157 |
| Resistors | p. 158 |
| Dielectrics and Ferrites | p. 160 |
| Phosphor Materials for Information Display Technologies | p. 166 |
| Materials for Metal-Air Batteries and Proton Exchange Membrane Fuel Cells | p. 170 |
| Conclusions | p. 172 |
| Direct-Write Techniques | |
| Direct Write Using Ink-Jet Techniques | p. 177 |
| Introduction | p. 177 |
| History | p. 178 |
| Background on Ink-Jet Technology | p. 178 |
| Jetting Materials | p. 183 |
| Pattern/Image Formation: Fluid/Substrate Interaction | p. 185 |
| Throughput Considerations | p. 190 |
| Direct-Write Applications | p. 190 |
| Commercial Systems | p. 219 |
| Future Trends | p. 222 |
| Summary | p. 223 |
| Micropen Printing of Electronic Components | p. 229 |
| Introduction | p. 229 |
| The Micropen | p. 230 |
| Rheological Characteristics of Thick-Film Pastes | p. 232 |
| Prototyping of Components from Commercial Slurries | p. 249 |
| Summary | p. 256 |
| Direct Write Thermal Spraying of Multilayer Electronics and Sensor Structures | p. 261 |
| Introduction | p. 261 |
| Process Description | p. 265 |
| Materials and Microstructural Characteristics | p. 268 |
| Multilayer Electronic Circuits and Sensors by Thermal Spray | p. 291 |
| Fine Feature Deposition by Direct-Write Thermal Spray | p. 294 |
| Summary | p. 299 |
| Dip-Pen Nanolithography: Direct Writing Soft Structures on the Sub-100-Nanometer-Length Scale | p. 303 |
| Introduction | p. 303 |
| Scanning Probe Microscope Methods | p. 304 |
| Dip-Pen Nanolithography Methods | p. 304 |
| Future Issues | p. 310 |
| Nanolithography with Electron Beams: Theory and Practice | p. 313 |
| Introduction | p. 313 |
| The Areal Image | p. 318 |
| Conventional Probe-Forming E-Beam Tools | p. 318 |
| Mathematical Approaches to Proximity Control | p. 331 |
| Summary and Conclusions | p. 344 |
| Focused Ion Beams for Direct Writing | p. 347 |
| Introduction | p. 347 |
| Equipment | p. 348 |
| Ion Solid Interaction | p. 353 |
| Applications | p. 369 |
| Conclusions | p. 376 |
| Laser Direct-Write Micromachining | p. 385 |
| Introduction | p. 385 |
| Trends in Microfabrication | p. 387 |
| Overview of Laser-Matter Interactions | p. 387 |
| Laser Micromachining | p. 394 |
| Summary | p. 412 |
| 3D Microengineering via Laser Direct-Write Processing Approaches | p. 415 |
| Introduction | p. 415 |
| The Laser Direct-Write 3D Processing Tool | p. 419 |
| Laser Material Interaction Physics | p. 421 |
| Topics Relevant to 3D Laser Microengineering | p. 433 |
| 3D Microfabrication by 2D Direct-Write Patterning Approaches | p. 438 |
| Direct-Write Volumetric (3D) Patterning | p. 448 |
| Tailoring the Material to Advantage | p. 460 |
| Summary and Conclusions | p. 462 |
| Flow- and Laser-Guided Direct Write of Electronic and Biological Components | p. 475 |
| Motivation | p. 475 |
| Fundamentals | p. 477 |
| Material Results | p. 482 |
| Electronic Components | p. 486 |
| Future Work | p. 487 |
| Conclusion | p. 488 |
| Laser-Induced Forward Transfer: An Approach to Single-Step Microfabrication | p. 493 |
| An Overview of the Laser-Induced Forward Transfer Process | p. 493 |
| Deposition of Single Elements | p. 496 |
| Deposition of Oxide Compounds | p. 500 |
| Transfer Mechanisms | p. 504 |
| Applications of LIFT | p. 509 |
| Summary and Conclusions | p. 514 |
| Matrix Assisted Pulsed Laser Evaporation-Direct Write (MAPLE-DW): A New Method to Rapidly Prototype Organic and Inorganic Materials | p. 517 |
| Introduction | p. 518 |
| Background | p. 519 |
| Matrix Assisted Pulsed Laser Evaporation-Direct Write | p. 521 |
| MAPLE-DW of Inorganic Materials | p. 530 |
| MAPLE-DW of Organic and Biomaterials | p. 543 |
| Summary and Future Work | p. 550 |
| Comparison to Other Approaches to Pattern Material | |
| Technologies for Micrometer and Nanometer Pattern and Material Transfer | p. 557 |
| Introduction | p. 558 |
| Applications of Pattern Transfer Technologies | p. 563 |
| Overview of Pattern Transfer Technologies | p. 572 |
| Optical Lithographies | p. 583 |
| Extreme Ultraviolet Lithography | p. 589 |
| X-ray Lithography | p. 593 |
| Particle Lithographies | p. 596 |
| Proximal Probe Lithography | p. 599 |
| Other Pattern Transfer Methods | p. 603 |
| Applications of Material Transfer Technologies | p. 609 |
| Overview of Material Transfer Technologies | p. 612 |
| Fixed Pattern Subtractive Techniques | p. 615 |
| Programmable Subtractive Techniques | p. 621 |
| Fixed Pattern Additive Material Transfer Methods | p. 625 |
| Programmable Additive Liquid Methods | p. 628 |
| Beam-Based Programmable Additive Techniques | p. 639 |
| Other Programmable Additive Technologies | p. 645 |
| Three-Dimensional Rapid Microprototyping | p. 650 |
| Molding and Related Technologies | p. 655 |
| Pattern and Material Transfer by Self-Assembly | p. 665 |
| Comparison of Pattern and Material Transfer Techniques | p. 671 |
| Conclusion | p. 674 |
| Ancillary Techniques | p. 680 |
| Radiation Sources | p. 680 |
| Masks | p. 681 |
| Stage Motion and Pattern Alignment | p. 681 |
| Materials for Thin Films | p. 683 |
| Processes for Thin Films | p. 685 |
| Characterization of Materials and Tools | p. 686 |
| Metrology and Inspection of Patterns and Structures | p. 687 |
| Packaging | p. 688 |
| Permissions | p. 700 |
| Index | p. 702 |
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