Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.
1 Models for VLSI Manufacturing Yield.- Fault-Free or Fault-Tolerant VLSI Manufacturing.- Yield Models - Comparative Study.- 2 Models for Defects and Yield.- A Unified Approach to Yield Analysis of Defect Tolerant Circuits.- Systematic Extraction of Critical Areas From IC Layouts.- The Effect on Yield of Clustering and Radial Variations in Defect Density.- 3 Implementation of Wafer Scale Integration.- Practical Experiences in the Design of a Wafer Scale 2-D Array.- Yield Evaluation of a Soft-Configurable WSI Switch Network.- ASP Modules: WSI Building-Blocks for Cost-Effective Parallel Computing.- 4 Fault Tolerance.- Fault-Tolerant k-out-of-n Logic Unit Network With Minimum Interconnection.- Extended Duplex Fault Tolerant System With Integrated Control Flow Checking.- Experience in Functional Test and Fault Coverage in a Silicon Compiler.- 5 Array Processors.- APES: An Evaluation Environment of Fault-Tolerance Capabilities of Array Processors.- Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays.- An Integer Linear Programming Approach to General Fault Covering Problems.- Probabilistic Analysis of Memory Repair and Reconfiguration Heuristics.- Arithmetic-Based Diagnostics in VLSI Array Processors.- 6 New Approaches and Issues.- Yield Improvement Through X-RAY Lithography.- Reliability Analysis of Application-Specific Architectures.- Fault Tolerance in Analog VLSI: Case Study of a Focal Plane Processor.- 7 Yield and Manufacturing Defects.- Yield Model With Critical Geometry Analysis for Yield Projection from Test Sites on a Wafer Basis With Confidence Limits.- SRAM/TEG Yield Methodology.- A Fault Detection and Tolerance Tradeoff Evaluation Methodology for VLSI Systems.- 8 Designs for Wafer Scale Integration.- A Hypercube Design on WSI.- An Efficient Reconfiguration Scheme for WSI of Cube-Connected Cycles With Bounded Channel Width.- A Communication Scheme for Defect Tolerant Arrays.
Series: Defect & Fault Tolerance in VLSI Systems : Book 2
Number Of Pages: 316
Published: 31st October 1990
Publisher: Springer Science+Business Media
Country of Publication: US
Dimensions (cm): 23.39 x 15.6
Weight (kg): 0.64