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Cambridge Studies in Semiconductor Physics and Microelectronic Engineering : Silicon Micromachining Series Number 7 - M. Elwenspoek

Cambridge Studies in Semiconductor Physics and Microelectronic Engineering

Silicon Micromachining Series Number 7

By: M. Elwenspoek, H.V. Jansen, Haroon Ahmad (Editor), Michael Pepper (Editor), Alec Broers (Editor)

Paperback

Published: 19th August 2004
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This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).

'This book has many admirable properties. It covers the chosen subject in considerable detail and brings together much of the state-of-the-art. The illustrations and photographs are of very high quality and indeed the whole book is well presented. It will be useful to both the experienced engineer wishing to sort out a few problems in his own work and to those requiring an introduction to silicon microengineering' Professor R. A. Lawes, Engineering Science and Education Journal

Introduction
Anisotropic wet chemical etching
Chemical physics of wet chemical etching
Waferbonding
Examples and applications
Surface micromachining
Isotropic wet chemical etching of silicon
Introduction into dry etching
Why plasmas?
Plasma system configurations
What is plasma etching?
Contact plasma etching
Remote plasma etching
High aspect ratio trench etching
Moulding of microstructures
Fabrication of movable microstructures
Table of Contents provided by Publisher. All Rights Reserved.

ISBN: 9780521607674
ISBN-10: 0521607671
Series: Cambridge Studies in Semiconductor Physics and Microelectronic Engineering
Audience: Professional
Format: Paperback
Language: English
Number Of Pages: 420
Published: 19th August 2004
Publisher: Cambridge University Press
Country of Publication: GB
Dimensions (cm): 24.6 x 18.9  x 2.2
Weight (kg): 0.75