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Advanced Wirebond Interconnection Technology - Shankara K. Prasad

Advanced Wirebond Interconnection Technology

Book with Other Items Published: 30th April 2004
ISBN: 9781402077623
Number Of Pages: 669

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Book with Other Items

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From the reviews:

'

This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.

The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.

The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.

This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. A CD comes with the book and contains close-ups and animation of the different wire bonding methods - a great visual learning tool which is a step ahead of past books.

Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.

If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book. " ( CMPT Newsletter, June 2005)

From the reviews:

"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)

"This book is intended for an assembly ... . is very good with `visual' explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)

Preface
Acknowledgments
Introductionp. 1
Materials for wirebondingp. 17
Bonding equipmentp. 95
Process technologyp. 163
Qualityp. 481
Reliabilityp. 559
New technologies and new applications for wire bondingp. 629
Referencesp. 655
Indexp. 661
About the authorp. 669
Table of Contents provided by Blackwell. All Rights Reserved.

ISBN: 9781402077623
ISBN-10: 1402077629
Audience: Professional
Format: Book with Other Items
Language: English
Number Of Pages: 669
Published: 30th April 2004
Publisher: Springer-Verlag New York Inc.
Country of Publication: US
Dimensions (cm): 23.5 x 15.5  x 3.18
Weight (kg): 2.55