A Guide to Lead-Free Solders

Physical Metallurgy and Reliability

By: John W. Evans, Dong-il Kwon (Contribution by), Werner Engelmaier (Editor)

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Hardcover | 12 December 2006

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222 Pages

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25.4 x 17.15 x 0.64

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The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.

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You Can Find This Book In

Non-Fiction Engineering & Technology Mechanical Engineering & Materials Materials Science Electronics & Communications Engineering Electronics Engineering Energy Technology & Engineering Electrical Engineering Other Technologies & Applied Sciences Applied Optics Industrial Chemistry & Manufacturing Technologies Metals Technology & Metallurgy

Mechanical Engineering Technology in General Engineering in General Production & Industrial Engineering Industrial Quality Control

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Paperback

Published: 13th October 2010

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Introduction to Solder Alloys and Their Properties	p. 1
Evolution of Packaging Architectures	p. 2
Solder Alloys	p. 6
SnPb Alloys	p. 7
Pb-free Alloys	p. 8
Specialized Processing and Microalloying	p. 8
Wetting and Joint Formation	p. 9
Monotonic Properties of Solder Alloys	p. 10
Creep and Stress Relaxation	p. 15
Cyclic Behavior and Creep Fatigue Interaction	p. 17
Microstructure and Cyclic Behavior	p. 23
References	p. 25
Packaging Architecture and Assembly Technology	p. 29
Packaging Architectures	p. 29
Leaded Semiconductor Packages	p. 29
Package and Lead Types	p. 30
Lead Finishes	p. 32
Pure Sn Coatings - Tin Pest and Tin Whiskers	p. 34
Tin Pest - The Allotroptc Transformation of Sn	p. 34
Extrusions - Whisker Growth	p. 35
Ball-grid Arrays and Chip-scale Packages	p. 37
Flip-chip Packaging	p. 38
Pb-free EGA, CSP and Flip Chips	p. 39
Assembly Technology	p. 40
Solder Paste	p. 40
Stenciling	p. 44
Solder-paste Performance: Slumping	p. 45
Reflow Soldering	p. 47
Wave Soldering	p. 48
Cleaning	p. 50
References	p. 50
Wetting and Joint Formation	p. 53
Wetting	p. 55
Basic Wetting Mechanics	p. 55
Reactive Wetting of Sn on Substrates	p. 57
Fluxes	p. 58
Wetting Characteristics of Binary Eutectic Pb-free Solder Alloys	p. 61
Wetting Characteristics of Ternary SnAgCu Alloys	p. 63
Solderability and Solderability Testing	p. 63
Primary Solderability Defects	p. 64
Immersion Testing	p. 65
The Wetting Balance	p. 66
Importance of Flux Activity in Wetting and Solderability Testing	p. 68
Solidification	p. 70
Basic Theory of Solidification	p. 70
Solidification and Melting Studies in Lead-Free Solders by Differential Scanning Calorimetry	p. 72
As-cast Microstructures of Solder Alloys	p. 73
SnPb Euctectic	p. 74
SnAg Eutectic Solder	p. 74
SnAgCu Ternary Solders	p. 75
Segregation and Solidification Defects in some Pb-free Alloys	p. 75
References	p. 77
Microstructural Instability in Solders	p. 79
Effects of Microstructural Coarsening and Aging on Properties of Solder	p. 79
Sources of Microstructural Instability in Solder	p. 82
Thermodynamics of Microstructural Instability	p. 83
Kinetics of Coarsening Processes in Microstructure	p. 84
Grain-growth Models	p. 84
Mechanical Instability	p. 85
A Simplified Model for Thermal Coarsening	p. 85
Strain and Thermal Coarsening in SnAgCu	p. 88
Quantifying Alloy Effects on Microstructure	p. 91
References	p. 94
Intermetallic Formation and Growth	p. 97
Characteristics of Intermetallic Compounds	p. 97
Cu-Sn	p. 98
Ag-Sn	p. 102
Au-Sn	p. 103
Ni-Sn	p. 106
Growth Kinetics of IMCs in Layered Morphologies	p. 107
Thermodynamic Driving Forces in Intermetallic Systems	p. 107
Kinetics and Diffusion: Basic Theory	p. 112
Experimental Kinetics for IMC Growth in Solders	p. 112
Characterization of IMC Layers and Secondary Phases	p. 116
Microstructural Preparation and Samples	p. 116
SEM and EDX	p. 117
Hardness and Mechanical Properties	p. 117
X-ray Diffraction	p. 121
References	p. 122
Mechanical Properties and Creep Behavior	p. 127
Monotonic Properties of Solders	p. 127
Basic Monotonic Behavior	p. 127
Pb-free Alloys: Strength vs Ductility	p. 129
Temperature and Strain-rate Sensitivity	p. 131
Strain-rate Sensitivity: Estimating Fatigue and Creep Performance from Tensile Properties	p. 133
Creep and Stress Relaxation	p. 135
Influence of Microstructure	p. 139
References	p. 142
Thermomechanical Fatigue	p. 145
Mechanisms of Fatigue Cracking in Solder Alloys	p. 145
Cyclic Strain: A Simplified Perspective	p. 149
Constitutive Analysis and Viscoplastic Finite Element Calculations for Strain Analysis in Solder Alloys	p. 153
Fatigue Models for Solder Alloys	p. 155
Statistical Analysis of Fatigue Data	p. 164
Monte Carlo Simulations of Fatigue Life	p. 168
Statistical Results for Selected Pb-Free Alloys	p. 173
Isothermal Fatigue Curves for Pb-free Solders	p. 176
Summarizing SnAgCu Fatigue Behavior	p. 177
Comparative Testing of Alloys: Statistical Approaches	p. 179
Experimental Results for Alloy Comparative Tests	p. 180
Discussion on Fatigue and Microstructural Test Results for Alloy Comparison Example	p. 182
References	p. 183
Product Assurance	p. 187
Environment	p. 187
Design for Reliability	p. 189
Controlled Processes	p. 191
Accelerated Testing	p. 196
Qualification Testing Development: A Case History for Space Flight Development Using SnPb Eutectic Solder	p. 199
References	p. 201
Index	p. 203
Table of Contents provided by Ingram. All Rights Reserved.

A Guide to Lead-Free Solders

Physical Metallurgy and Reliability

At a Glance

Hardcover

Shipping

How to return your order

Defective items

You Can Find This Book In

Other Editions and Formats

Paperback

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